Abbreviation related to PCB Manufacturing QualiEco Australia

Glossary and Abbreviations - Abbreviations for Printed Circuit Boards

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A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Alphabet A [ Go to TOP ]

ACalternate current
ACIautomatic component inser tion
ADJadjust
ALaluminum = Aluminium
AMPamperage / Ampere
AMTamount
ANALanalysis / analyze
ANGangle
ANSIAmerican National Standards Institute
AOIautomatic optical inspection
APLapplicable
APRautomatic photo tool registration
AQLacceptance quality level
ARannular ring
ASAPas soon as possible
ASSYassembly
ASTMAmerican Society for Testing & Materials
AUgold
AUTHauthorize / authorization
AUXauxiliary
AVGaverage
AWartwork

Alphabet B [ Go to TOP ]

B&Tbow and twist
BBTbare board test
BDboard
BGAball grid array
BKback
BKPLNbackplane
BKPNLback panel
BKTbracket
BLKblack / block
BLNKblank
BLUblue
BObreak out
BOMbill of material
BPbackplane / back panel
BRDboard
BSbackside
BTMbottom
BUMbuilt up method
BUTbuilt up technology
BVHburied via hole
BVLbevel

Alphabet C [ Go to TOP ]

Ccircuitry
CADcomputer-aided design
CAEcomputer-aided engineering
CAIcomputer-aided instruction
CALCcalculate
CAMcomputer-aided manufacturing
CAPcapacitor / capacity
CBOREcounter bore
CCconformal coating
CCCcurrent carrying capacity
CEM-1Composite epoxy material. Laminate manufactured with a paper core, outer layers of fibre-glass and epoxy as binding agent. Normally non-inflammable = Composite Epoxy Material.
CFcopper foil
CHARcharacter / characteristic
CHGchange
CHKcheck
CIcontrolled impedance
CIRCcircuit
CLclass
CLNclean
CLRclear / clearance
CMPcomponent
CNCcomputer numerically controlled
CNTcount
CNTRcenter
CNTRLcontrol
COBchip on board
CofCcertificate of conformance
COMPcomponent
CONDconductor / condition
CONFconformance / conference
CONNconnector
CEM-3Composite epoxy material. Laminate manufactured with non-woven glass matting as core, outer layers of gass weave and epoxy as binding agent. Normally noninflammable = Composite Epoxy Material.
CONTcontinue / continuity
Cpkprocess capability index (range within specification)
CPNcoupon = Coupon
CScomponent side
CSKcountersink
CSPchip size package
CTEcoefficient of thermal expansion
CUcopper
CVRcover

Alphabet D [ Go to TOP ]

DCdirect current / date code / document control
DECdecimal
DECdocument
DEGdegree
DEPdeposit / deposition
DESdevelop-etch-strip / design
DESCDefense Electronic Supply Center = Defense Electronic Supply Center (USA)
DFdry film / difunctional
DFMdesign for manufacturability
DFTdouble-treat foil / design for test
DIAdiameter
DIELdielectric
DIMdimension = Dimension
DISTdistribute / distribution
Dkdielectric constant
DLADefense Logistics Agency = Defense Logistics Agency (USA)
DODDepar tment of Defense / Date of Delivery
DPdrill program
DRCdesign rule check
DRLdrill
DSdimensional stability / double-sided
DTFdouble-treat foil
DTLdetail = Detail
DTPdiameter
DWGdrawing
DWVdielectric with standing voltage

Alphabet E [ Go to TOP ]

E-AUelectroless gold
ECeach
EEelectrical engineer
EMSelectronics manufacturing services
EMULemulsion = Emulsion
ENGengineer / engage
ENGRengineer
E-NIelectroless nickel
ENIGelectroless nickel immersion gold
ERrelative dielectric constant
ESDelectro-static discharge / electro-static device
ETelectrical test
EVALevaluation / evaluate
EXexample
EXPexpose / exposure / expire
EXTexternal / extension

Alphabet F [ Go to TOP ]

FR2Flame Retardant. Laminate manufactured from paper with phenolic binding agent. Flame retardant material has been added
FR3Flame Retardant. Laminate manufactured from paper with epoxy binding agent. Flame retardant material has been added.
FAfirst article
FABfabrication / fabricate
FAEfirst article report
FAIfirst article inspection
FGIfinished goods inventory
FHSfinished hole size
FR4Flame Retardant. Laminate manufactured from fibre-glass weave with epoxy binding agent. Flame retardant material has been added.
FLTflat
FMfrom
FNLfinal
FPWflex printed wiring
FREQfrequency
FSfar side
FUNCfunction / functional

Alphabet G [ Go to TOP ]

GLSglass
GNDground
GRNgreen

Alphabet H [ Go to TOP ]

HALhot air leveling
HARBheight aspect ratio boards
HASLhot air solder levelling
HDIShigh density interconnection system
HLhole
HLSholes
HMTHole mounting technology. Leaded components are mounted by inser ting (and soldering) their leads through holes in the PCB
HRChigh resin content
HTEhigh tensile elongation

Alphabet I [ Go to TOP ]

IECInternational Electro-technical Commission
IJInkjet
IJPInkjet Printing
ILinner layer
ILinsulation resistance / infrared
IMGimage
IMMimmersion
IMMAUimmersion gold
INSPinspect / inspection
INTinternal
INVinventory
IPCInstitute for Interconnecting and Packaging Electronic Circuits
ISinside / information system
ISSissue
ITRIInterconnection Technology Research Institute
IVHInterstitial Via Hole (Board)

Alphabet J [ Go to TOP ]

JITJust in time
JSJump Scoring

Alphabet K [ Go to TOP ]

KFkapton film

Alphabet L [ Go to TOP ]

LAMlaminate / lamination
LCCleadless chip carrier
LCCCleadless ceramic chip carrier
LDILaser Direct Imaging
LDPLaser Direct Patterning
LDSLaser Direct Structuring
LEGlegend
LIGALithography and Galvanoforming (technique)
LOClocate / location
LPIliquid photoimageable
LPISRliquid photoimageable solder resist
LRClow resin content
LSRlaser
LWline width
LYRlayer

Alphabet M [ Go to TOP ]

MATLmaterial = Material
MBVmicro blind via
MEmechanical engineer
MFmultifunctional
MFGmanufacturing
MFRmanufacturer
MGRmanager = Manager
MINminimum = Minimum
MIPmanufacturing instruction procedure / multiple inline package
MIRmoisture & insulation resistance
MLmultilayer
MLBmultilayer board
MMCmaximum material condition
MRBmaterial review board
MRPmanufacturing resource planning
MSGmessage
MSTRmaster
MTLmetal
MVmicro via
MVHmicro via hole

Alphabet N [ Go to TOP ]

NAnot applicable
NCnumerically controlled
NCMnon-conforming
NEGnegative
NEMANational Electrical Manufacturer's Association
NFnon-functional
NHSnominal hole size
NInickel = Nickel
Ni/Pnickel / phosphor
NOMnominal
NPnon-plated
NPTnon-plated thru
NPTHnon-plated-thru hole
NSTDnon-standard
NTSnot-to-scale

Alphabet O [ Go to TOP ]

OAoverall
OAIo.k. as is
ODouter diameter
OEMoriginal equipment manufacturer
OLouter layer
ORGorganize / organization
ORIGoriginal
OSoptical sight / Fiducial marks
OSIon-screen inspection
OSPorganic solderability preservative (anti-oxidant coating)
OZounce

Alphabet P [ Go to TOP ]

PACpad array carrier
Pblead
PbSnlead-tin
PCprinted circuit / production control
PCBprinted circuit board
PCTpressure cooker testing
PEproduct engineer / process engineer
PEBpost exposure bake
PEPpost-etch punch
PFIpolymer film interconnect
PIDphotoimageable dielectric
PIHpin in hole
PLparts list
PLCplace
PLCSplaces
PLNplane / plan
PLNGplanning
PLNRplanner
PLTplate
PLTDplated
PMpreventive maintenance
PNLpanel
POSpositive
PPprepreg
PQFPplastic quad flat package
PROGprogram
PSFper square foot
PSIper square inch
PTperfect test / point
PTHplated-thru hole
PTSpoints
PWAprinted wiring assembly
PWBprinted wiring board

Alphabet Q [ Go to TOP ]

QAquality assurance
QCquality control
QEquality engineer
QFPquad flat pack
QPLquality product level
QTAquick-turn around
QUALqualification / qualify

Alphabet R [ Go to TOP ]

RADradius / radii
RCCresin coated copper foil
REFreference
REGregistration / register
REINreinforce
RELrelease
REMremove
REPrepresentative / represent
REPLreplace
REQrequest / require
RESresistor
RFQrequest for quotation
RMKremake
RProut program
RPRrepair
RPTreport
RTrout
RTFreverse-treat foil
RWKrework

Alphabet S [ Go to TOP ]

SBCsolder ball connect
SBUsequential built-up
SnTin
SNserial number
SCRNscreen
SPspace
SQsquare
SEPseparate
SECTsection
SHTsheet
SIASemiconductor Industry Association
SIGsignal
SIPsingle in-line package
SIRsur face insulation resistance (resistivity)
SLDsolder
SLTslot
SMCsurface-mount component
SMDsurface-mount device
SMPsurface-mount pad
SMTsurface-mount technology
SMOBCsolder mask over bare copper
SMOGBsolder mask over gold body
SPCstatistical process control
SPECspecification
STDstandard
SSsolder side
SSDSolid Solder Deposit
STKstock / stack
SYMsymbol
SRCSemiconductor Research Consor tium
S&Rscrap and rework
SLDsolder
SQFTsquare foot
SQINsquare inch

Alphabet T [ Go to TOP ]

TFtetra functional
Tgglass transition temperature
THtooling hole(s)
TPtrue position
TRtransfer
TABtape-automatic bonding
TDRtime domain reflectometer
TGPtrue grid position
TGTtarget

Alphabet U [ Go to TOP ]

ULUnderwriter's Laboratories Inc.
UAIuse as it
UOSunless otherwise specified

Alphabet V [ Go to TOP ]

Vvoltage = Volt

Alphabet W [ Go to TOP ]

Wwidth
W&Twarp and twist
WBwire bonding
WHTwhite
WEEEwaste electronic and electrical equipment

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