Glossary & Terminology PCB Manufacturing QualiEco Australia

Glossary and Abbreviations - PCB Glossary

Click on an alphabet below to directly jump to the chosen alphabet section...

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Alphabet E

Edge ConnectorA connector on the circuit board edge in the form of gold plated pads or lines of coated holes used to connect other circuit board or electronic device.
Edge ClearanceThe smallest distance from any conductors or components to the edge of the PCB.
Electrode depositionThe deposition of a conductive material from a plating solution by the application of electrical current.
Electroless Desposition/PlatingThe deposition of conductive material from an auto catalytic reduction of a metal ion on certain catalytic surfaces.
ElectroplatingThe electrode position of a metal coating on a conductive object. The object to be plated is placed in an electrolyte and connected to one terminal of a DC voltage source. The metal to be deposited is similarly immersed and connected to the other terminal. Ions of the metal provide transfer to metal as they make up the current flow between the electrodes.
Electrical Test(1-sided / 2-sided) Testing is used primarily to test for opens and shorts. PCBpro recommends testing for all surface mount boards and multi-layer orders (3 layers & up). The quoted price is accurate up to 1000 test points for a one-sided test fixture, and up to 600 points for a double-sided surface mount test fixture.
End-to-end designA version of CAD,CAM and CAE in which the software packages used and their inputs and outputs are integrated with each other and allow design to flow smoothly with no manual intervention necessary (other than a few keystrokes or menu selections) to get from one step to the other. Flow can occur in both directions. In the field of PCB design, end-to-end design sometimes refers to only the electronic schematic/pcb layout interface, but this is a narrow view of the potentialities of the concept.
E-pad"Engineering-pad." A plated-through hole or surface mount pad on a PCB placed on the board for the purpose of attaching a wire by soldering. These are usually labeled with silkscreen. E-pads are used to facilitate proto-typing, or simply because wires are used for interconnections instead of headers or terminal blocks.
EpoxyA family of thermosetting resins. Epoxies form a chemical bond to many metal surfaces.
Epoxy SmearEpoxy resin that has been deposited on edges of copper in holes during drilling either as uniform coating or in scattered patches. It is undesirable because it can electrically isolate the conductive layers from the plated-through-hole interconnections.
ESRElectro-statically applied Solder Resist.
EtchingRemoving unwanted metallic substance by chemical or chemical/electrolytic process
Etch backThe controlled removal by a chemical process, to a specific depth, of nonmetallic materials from the sidewalls of holes in order to remove resin smear and to expose additional internal conductor surfaces.
Excellon Drill FileIn order to process your order, we require a drill file (with x-y coordinates) that is viewable in any text editor.

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